Tuesday, July 24, 2012
Samsung may begin producing flexible AMOLED displays this quarter
Tuesday, July 10, 2012
BitTorrent Torque web app turn browser into a file-sharing hub
Tuesday, July 3, 2012
Micron to buy Elpida, DRAM market left with 3 competitors
Monday, December 5, 2011
Samsung shows transparent flexible tablet in concept video
Tuesday, November 29, 2011
Microsoft: We've had Siri-like technology for over a year
Monday, August 1, 2011
iPhone 5 production started, 4-inch screen and metal chassis
Reports have come out of Japan that indicate that the iPhone 5 has just started initial production and is slated for release in Q3 of this year. We all knew when the new iPhone 5 would be released, it’s usually about the same time each year but we didn’t know specific details about the phone. The new phone will come with a 4-inch capacitive touch screen as well as a metal chassis to help with antenna sensitivity. It looks like Apple is trying to correct the antenna issue that was uncovered as the iPhone 4 was released last year. The phone will also contain Apples A5 dual-core chip the same as which is inside the new iPad 2.
The new iPhone 5 is also said to be equipped with an “induction pay” or “wave and pay” technology that will allow consumers to use their phones to make purchases at establishments. This technology is made possible by the NFC or “Near Field Communication” chip installed in the phone. The technology is very similar to the current “pay pass” technology that we have on many credit cards today. With this addition to the iPhone 5, you will always be carrying around a sort of “e-wallet” that should speed up payments at enabled establishments. This new news also confirms many rumors that we wrote about earlier.
Thursday, February 17, 2011
Micron develops 'Hyper Memory Cube' technology
Essentially, DRAM performance today is constrained by the capacity of the data channel that sits between the memory and the processor. This channel often becomes a choke point for data, no matter how much faster the DRAM chip itself gets, which was more recently evidenced in the industry's slow transition from DDR2 to DDR3 as desktop and notebook makers weren't really seeing a big enough improvement to warrant the move.
There isn't much in the way of technical details at the moment but it would appear that Micron is leveraging memory architecture knowledge from its Numonix acquisition last year to stack several memory layers atop each other and adding a controller chip right into the memory substrate. This not only allows a higher speed bus that will go from the controller chip to the CPU, it also means that memory could be packed more densely in a given volume.
The company hopes to see the so-called "Hybrid Memory Cube" technology in server and networking markets as early as 2012, with significant volumes in 2013, and could then start to work their way toward the consumer space in 2015.